Assembling and Handling Edge Interconnect Packaging System

ABSTRACT

A first microchip includes holes or sockets along or in a top face or surface of the first microchip and a second microchip includes nodules extending from a edge of the second microchip. The nodules of the second microchip are received in the holes or sockets along or in the top face or surface of the first microchip, whereupon the first and second microchips are positioned transverse or perpendicular to each other.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/817,727, filed Nov. 20, 2017, which is a divisional of U.S. patentapplication Ser. No. 14/211,127, filed Mar. 14, 2014, which claimspriority from U.S. Provisional Application No. 61/802,504, filed Mar.16, 2013, all of which are incorporated herein in their entireties byreference.

BACKGROUND OF THE INVENTION Field of the Invention

The described apparatuses and methods relate to the field of microchiphandling and assembly. More particularly, the described apparatus andmethods relate to the handling and assembly of microchips configuredwith solid edge-to-edge interconnects.

Description of Related Art

Generally, electronic systems are comprised of multiple discretemicrochips. These microchips work together, along with other peripheraldevices, to accomplish particular tasks. For the system to function, thediscrete microchips must be electrically connected, both to each otherand to any other components contained within the system. A wide varietyof methods presently exists to accomplish this connectivity, includingwire-bonding, bump-bonding, flip-chip, through-silicon-via (TSV), andchip-on-board. Each of these methods is specialized to function with anassociated interconnect technology. Specialized assembly and packagingtools are used to handle, align, interconnect, and package microchips.These tools must be designed to accommodate the particular packaging andinterconnection approach selected. As new interconnect technologies arecreated, it becomes necessary to develop new specialized methods andtools to effectively connect microchips using the new technology.Accordingly, there exists a need for new assembly methods andapparatuses that are capable of functioning with cutting-edgeinterconnect technologies.

SUMMARY OF THE INVENTION

The following presents a simplified summary in order to provide a basicunderstanding of some aspects of the claimed subject matter. Thissummary is not an extensive overview. It is not intended either toidentify key or critical elements or to delineate the scope of theclaimed subject matter. Its sole purpose is to present some concepts ina simplified form as a prelude to the more detailed description that ispresented later.

With the creation of microchips configured with solid edge-to-edgeinterconnects, a need has arisen for new, specialized tools and methodsto effectively connect discrete microchips together. For example,existing methods are incapable of the precision alignment required toconnect multiple edge-based contact points. Further, existing methodsare inadequate at reliably forming functional mechanical and electricalconnections directly between adjacent microchips.

Accordingly, the described apparatuses and methods relate to the fieldof microchip assembly and handling, in particular to devices and methodsfor assembling and handling microchips manufactured with solidedge-to-edge interconnects, such as Quilt Packaging® interconnecttechnology. Specialized assembly tools are described that are configuredto pick up one or more microchips, place the microchips in a specifiedlocation aligned to a substrate, package, or another microchip, andfacilitate electrical contact through one of a variety of approaches,including solder reflow. This specialized assembly tooling performsheating functions to reflow solder to establish electrical andmechanical interconnections between multiple microchips.

In an embodiment, after two or more microchips have been positioned andinterconnected on a package, the assembly tooling can finish either bysealing the package with a cover or sealant or by moving the assembledunit along for further processing.

In an embodiment, a device is capable of performing the precisionalignment needed to join solid edge-to-edge interconnect structures andprevent lateral movement and pressure during solder reflow. In anotherembodiment, vacuum is used to hold multiple microchips in place whileadditional microchips of the same or varying geometries, sizes, andthicknesses are aligned into an interconnected array or quilt. In anembodiment, microchips can be assembled into such an array either on astage and then reflowed or alternatively assembled directly on a packageor substrate and reflowed. In an embodiment, microchips can be assembledeither orthogonally or at other angles to one another. After assembly,the array of interconnected microchips can be moved into a package, ontoa substrate or board, encapsulated, or otherwise protected by theapplication of a protective material, such as an epoxy or polymer.

To the accomplishment of the foregoing and related ends, certainillustrative aspects of the claimed subject matter are described hereinin connection with the following description and the annexed drawings.These aspects are indicative of various ways in which the subject mattermay be practiced, all of which are intended to be within the scope ofthe claimed subject matter. Other advantages and novel features maybecome apparent from the following detailed description when consideredin conjunction with the drawings.

More specifically, disclosed herein is a method for interconnectingmicrochips comprising: (a) positioning a first microchip using a firstmanipulator, wherein the first microchip has a set of first noduleslocated on an edge of the first microchip; (b) securing the firstmicrochip in place; (c) positioning a second microchip using a secondmanipulator, wherein the second microchip has a set of second noduleslocated on an edge of the second microchip; (d) moving the secondmicrochip so that the set of second nodules is positioned proximate tothe set of first nodules; (e) securing the second microchip in place;and (f) joining the set of first nodules to the set of second nodules tointerconnect the first and second microchips.

The set of first nodules can be located closest to a top face of thefirst microchip. The set of second nodules can be located closest to atop face of the second microchip.

The first microchip and the second microchip can be positioned top-facedown on a substrate. The substrate can include a conductive segment orcontact that is joined to one nodule of the set of first nodules and onenodule of the set of second nodules when the first second microchips arepositioned top-face down on the substrate.

The sets of first and second nodules can maintain the first and secondmicrochips in spaced relation when the first and second sets of nodulesand the conductive segment or contact are joined.

The edge of the first microchip can be defined by the intersection of atop face of the first microchip and a side of the first microchip. Theedge of the second microchip can be defined by the intersection of a topface of the second microchip and a side of the second microchip.

The first microchip and the second microchip can be positioned top-facedown on a substrate. The substrate can include a conductive segment orcontact. The method can include joining the conductive segment orcontact to one nodule of the set of first nodules and one nodule of theset of second nodules.

Each set of nodules can include at least one nodule.

Also disclosed herein is a microchip unit comprising: a first microchiphaving a set of first nodules located along and projecting from an edgeof the first microchip, wherein the edge of the first microchip isdefined at an intersection of a top surface and another surface of thefirst microchip; a second microchip having a set of second noduleslocated along and projecting from an edge of the second microchip,wherein the edge of the second microchip is defined at an intersectionof a top surface and another surface of the second microchip; and asubstrate having a conductive segment or contact. The first and secondmicrochips are positioned top-face down on the substrate with the firstand second sets of nodules joined with each other with the first andsecond microchips in spaced relation and with the conductive segment orcontact joined to one nodule of the set of first nodules and one noduleof the set of second nodules.

A surface of at least one nodule of the first set of nodules can begenerally coplanar with the top surface of the first microchip. Asurface of at least one nodule of the second set of nodules can begenerally coplanar with the top surface of the second microchip.

BRIEF DESCRIPTION OF THE DRAWINGS

The systems, devices, and methods may be better understood by referringto the following description in conjunction with the accompanyingdrawings. The components in the figures are not necessarily to scale andsimply illustrate the principles of the systems, devices, and methods.For example, elements in the figures may be exaggerated in size tobetter aid in the understanding of the portrayed embodiments. Theaccompanying drawings illustrate only possible embodiments of thesystems, devices, and methods and are therefore not to be consideredlimiting in scope.

FIG. 1 depicts a microchip including edge interconnects or nodules;

FIG. 2 depicts interconnecting two microchips on a substrate via edgeinterconnects or nodules on each substrate;

FIG. 3 depicts difficulties in interconnecting two microchips ofdifferent thicknesses on a substrate, where the edge interconnects ornodules are at different heights from the surface of the substrate;

FIG. 4 depicts interconnecting two microchips of different thicknesseson a substrate via edge interconnects or nodules on each substrate.

FIG. 5 depicts interconnecting two microchips using multiplemanipulators;

FIG. 6A depicts two microchips aligned in three-dimensional space;

FIG. 6B depicts the two microchips of FIG. 6A interconnected inthree-dimensional space;

FIG. 7 depicts four microchips interconnected or positioned to beinterconnected together; and

FIG. 8 is a flow diagram of a method for interconnecting an arbitrarilylarge array of microchips.

DETAILED DESCRIPTION OF THE INVENTION

It is advantageous to define several terms before describing particularembodiments. It should be appreciated that the following definitions areused throughout this application.

DEFINITIONS

Where the definition of terms departs from the commonly used meaning ofthe term, the definitions provided below are intended, unlessspecifically indicated otherwise.

For the purposes of the present description, the term “direct electricalconnection” refers to the direct contact between interconnect nodules orbetween an interconnect nodule and an electrical contact so thatelectrical conduction current may pass between them.

For the purposes of the present description, the term “electronicdevice” refers to electronic circuitry and any device that includeselectronic circuitry. Examples of electronic devices include, but arenot limited to, microchips, package systems, transistors, printedcircuit boards (PCBs), amplifiers, sensors, inductors, capacitors,electrical connectors into which microchips may be plugged, etc.

For the purposes of the present description, the term “interposer”refers to any structure whose purpose is to extend or complete aconductive electrical connection between two electronic devices. In someembodiments, the conductive electrical connection between interconnectnodules or between an interconnect nodule and a contact may not bedirect. For example, in some embodiments, a conductive material, such assolder, may electrically connect two interconnect nodules or aninterconnect nodule with an electrical contact. Also, in someembodiments, connectors of various types may help conductively joininterconnect nodules.

For the purposes of the present description, the term “microchip” refersto any kind of chip having microfabricated or nanofabricated systemsbuilt thereon. Microchips include not only conventional integratedcircuits but also Microelectromechanical Systems (MEMS) chips and otherrelated technologies.

For the purposes of the present description, the term “complementarynodules” refers to two microchips containing nodules arranged in amirrored pattern to one another. In other words, two microchips withcomplementary nodules are capable of being aligned to form an electricalconnection between the two microchips via the nodules.

DESCRIPTION

Aspects of the system and methods are described below with reference toillustrative embodiments. The references to illustrative embodimentsbelow are not made to limit the scope of the claimed subject matter.Instead, illustrative embodiments are used to aid in the description ofvarious aspects of the systems and methods. The description, made by wayof example and reference to illustrative reference, is not meant tobeing limiting with regards to any aspect of the claimed subject matter.

Devices and methods described in this application are particularlywell-adapted for use in joining microchips manufactured with solidedge-to-edge interconnects, such as Quilt Packaging® interconnecttechnology, and will be described in that context. However, it willbecome apparent that this description is not illustrative of the onlyutility of the described devices and methods.

The assembly of advanced system-in-package (SiP) designs usinginnovative packaging and interconnect technology requires substantialinnovation in assembly and handling tools and methods. Currentapproaches for assembling and packaging microchips are wholly unsuitedfor advanced SiP designs. Accordingly, there exists a long-felt butunaddressed need for improved apparatuses and methods for precisely andreliably assembling advanced SiP designs.

FIG. 1 depicts a microchip 100 configured with solid edge-to-edgeinterconnects, such as those employed in microchips configured withQuilt Packaging® interconnect technology and described in U.S. Pat. Nos.7,608,919 and 7,612,443 to Bernstein et al. which are incorporatedherein by reference. “Quilt Packaging” is a U.S. registered trademark ofIndiana Integrated Circuits, LLC, U.S. Registration No. 4214679.

As shown in FIG. 1, nodules 102 made of metal or another conductivematerial are located along and extend from at least one edge 104 orsurface 110 of microchip 100. These nodules 102 are used to electricallyand mechanically connect microchips together, either through a directelectrical connection or via an interposer (such as solder). As shownhere, nodules 102 are located near the top face 106 (or surface) ofmicrochip 100. Generally, nodules 102 are either located contiguous toor a predetermined distance below top face 106 of microchip 100. Theplacement of nodules 102 may be standardized for a single microchip (sothat all of the nodules are located the same distance below top face106) or across different microchips to facilitate alignment of nodules102 on different microchips. However, one of skill in the art willappreciate that nodules 102 may be placed at any point along the edge104 of the microchip 100, so long as the two microchips to be joinedhave complementary nodules 102.

Microchip 100 is depicted in face-up orientation, such that whenmicrochip 100 is placed on a supporting surface 108, the face closest tothe nodules 102 (top face 106) is exposed. Conversely, a microchip wouldbe termed face-down if top face 106 (the face closest to the nodules102) were in contact with supporting surface 108, such that top face 106was not exposed. Placing two microchips 100 configured withcomplementary nodules 102 adjacent to one another, such that the nodules102 of the first microchip 100 contact the nodules 102 of a secondmicrochip 100, forms a direct electrical connection between the twomicrochips. Alternatively, the nodules 102 may be positioned such thatthey are close together but not in direct physical contact, allowing anindirect electrical connection between the two microchips through aninterposer (such as solder).

As described hereinafter, microchips may be joined together in a morepermanent fashion to form a stable electrical and mechanical connectionbetween them. An arbitrary number of microchips may be joined togetherto form an arbitrarily large array, allowing for electrical connectionsbetween each microchip and its neighbors. To facilitate the creation ofelectrical and mechanical connections between multiple microchips, in anembodiment, these nodules 102 are created with a coating of solder. Thissolder may further be used as an interposer to facilitate indirectelectrical connections.

Referring to FIG. 2, in one embodiment, a method is provided forconnecting two microchips 200 a, 200 b. A manipulator 204 (such as avacuum tool or a mechanical probe) places a first microchip 200 aface-up on a substrate 206 and maneuvers microchip 200 a into position.As used herein, the term “substrate” is a supporting surface or stage.Alternatively, first microchip 200 a could be placed into position on apackage, for example, to allow two microchips to be simultaneouslyjoined to each other and then immediately sealed into the package. Inthis instance, the package could be placed on substrate 206 and securedinto position prior to the microchip being placed on or in the package.

Once first microchip 200 a has been correctly positioned, it is securedin place. In an embodiment, first microchip 200 a is secured in place byapplying vacuum pressure via substrate 206. For example, holes may beincluded in substrate 206 through which vacuum may be applied to theback-side of first microchip 200 a. The amount of vacuum applied througheach hole or subset of holes may be individually controlled, allowingdifferent amounts of vacuum to exist at different locations on substrate206. Accordingly, a higher vacuum pressure could be applied to onemicrochip while a lower vacuum pressure is applied to a secondmicrochip—preventing the first microchip from moving while requiring apredetermined amount of force to move the second microchip. For example,the necessity of using a predetermined amount of force to overcome thevacuum and move the second microchip would decrease the likelihood ofthe second microchip accidently moving. Alternatively, first microchip200 a may be held in place by manipulator 204 or another physicalrestraint, such as a clip, backstop or brace attached to the substrate206.

After first microchip 200 a is secured in place, a second microchip 200b is then placed on substrate 206 by manipulator 204 and aligned withfirst microchip 200 a in the y-axis. In an embodiment, second microchip200 b is lightly restrained against substrate 206 by applying vacuumthrough holes located in substrate 206, so as to make it easier toperform the necessary fine adjustments to properly position secondmicrochip 200 b. In another embodiment, physical features on substrate206 (such as grooves, walls, etc.) are used to properly position secondmicrochip 200 b and prevent it from moving in the y-axis. Manipulator204 then moves second microchip 200 b along the x-axis until it is incontact with the first microchip. More specifically, second microchip200 b may be moved along any path until nodules 202 b on secondmicrochip 200 b are in contact with nodules 202 a on first microchip 200a. In an embodiment, lateral pressure is applied between the first andsecond microchips 200 a, 200 b (for example, by manipulator 204) alongthe x-axis.

As improper alignment may result in some or all of nodules 202 failingto form electrical or mechanical connections, in an embodiment thealignment of two or more pairs of nodules 202 a, 202 b located atopposite edges of two microchips 200 a, 200 b are checked, for example,through the use of machine vision or electrical testing using a probe.As an example, if microchips 200 a, 200 b are slightly misaligned or ifone of the microchips is skewed, a first pair of nodules 202 at one endof the set of nodules could be perfectly positioned for connection whilethe last pair of nodules (located at the opposite end of the chips)could be significantly misaligned. In an embodiment, larger nodules arecreated at each edge of the microchip to further facilitate proper x/yalignment.

Referring again to FIG. 2, second microchip 200 b is then held securelyin place similarly to first microchip 200 a. As will be apparent to oneof skill in the art, multiple manipulators 204 could be used, forexample, to secure or position both microchips 200 a, 200 bsimultaneously or to enable microchips 200 a, 200 b to be held in placewithout the use of vacuum or another physical restraint on substrate206.

After the two microchips 200 a, 200 b have both been secured in place tosubstrate 206, microchips 200 a, 200 b are connected together, bothelectrically and mechanically. In one embodiment, microchips 200 a, 200b are connected through a solder reflow process. Nodules 202 a, 202 b,located along the edges of microchips 200 a, 200 b that are to be joinedtogether, are coated in solder or a similar material prior topositioning the two microchips 200 a, 200 b together. Then, when the twomicrochips 200 a, 200 b are positioned together, nodules 202 a on firstmicrochip 200 a are placed in contact with nodules 202 b on secondmicrochip 200 b. Localized heat (e.g., from a hot air reflow gun, aninfrared reflow gun, a soldering iron, a light bulb, or anotherlocalized heat source) is then applied to nodules 202 a, 202 b to meltthe solder, allowing the solder on nodules 202 a to melt and merge withsolder on nodules 202 b, forming multiple continuous connections betweenmicrochips 200 a, 200 b at each pair of nodules 202 a, 202 b. The heatis then removed from nodules 202 a, 202 b, allowing the reflowed solderto cool and solidify into an unbroken electrical and mechanicalconnection between the two microchips 200 a, 200 b.

Alternatively, heat can be applied to the entirety of both microchips200 a, 200 b (e.g., by using heaters located in the substrate, heatingthe air surrounding microchips 200 a, 200 b, or another generalized heatsource) to raise the temperature of both microchips 200 a, 200 b to sometemperature T1 which is less than the melting point of the solder. Asecond, localized heat source is then used to raise the temperature ofthe solder on nodules 202 a, 202 b to a second temperature T2, which isat or above the reflow temperature of the solder. Among otheradvantages, this enables the solder to melt more quickly and avoidssubjecting the entirety of both microchips 200 a, 200 b to hightemperatures (such as T2), which could potentially damage microchips 200a, 200 b. Additionally, a less intense localized heat source may be usedto avoid damaging microchips 200 a, 200 b and to consume less power. Inanother embodiment, nodules 202 a, 202 b on microchips 200 a, 200 b arejoined through a welding process, such as laser welding. Alternatively,melted solder or a conductive epoxy can be applied to nodules 202 a, 202b to form direct or indirect connections between the microchips 200 a,200 b.

After microchips 200 a, 200 b have been connected together to form amulti-chip device, post-processing, such as packaging, may be performed.If microchips 200 a, 200 b were connected together inside a package, themulti-chip device can then be directly connected to the package througha process such as wire-bonding. Alternatively, the multi-chip device maybe encapsulated or otherwise protected by the application of aprotective material, such as an epoxy or polymer.

Referring to FIG. 3, the difficulties inherent to connecting twomicrochips 300 a, 300 b of different thicknesses is shown. In order toform a reliable electrical connection, nodules 302 a on first microchip300 a must be properly aligned with nodules 302 b on second microchip300 b. To form a direct electrical connection, each pair of nodulesshould be in direct physical contact with one another. Alternatively, anindirect electrical connection can be formed through the use of aninterposer, such as solder. This allows an electrical connection to beestablished even if the nodules are slightly misaligned. As shown inFIG. 3, when microchips of different thicknesses are to be connectedtogether, it may be difficult or impossible to form a direct electricalconnection between microchips 300 a, 300 b by placing them adjacent toone another in a face-up orientation, as nodules 302 a, 302 b will belocated at different heights off substrate 304. Further, as depicted inFIG. 3, if the distance between the nodules 302 a on the first microchip300 a and the nodules 302 b on the second microchip 300 b is greatenough, it may be impossible to form a reliable electrical connectioneven with the use of an interposer.

Referring to FIG. 4, a method of joining two or more microchips 400 a,400 b of different heights to form a microchip unit is described. Afirst microchip 400 a is placed face-down on a substrate 406 (e.g., astage, package, or printed circuit board) by a manipulator 404 andmaneuvered into position. The substrate 406 may be composed of amaterial to which solder will not adhere (e.g., a non-metallic compound)to avoid having the microchips 400 a, 400 b inadvertently connected tothe substrate 406. Once it is properly positioned, first microchip 400 ais secured in place. Manipulator 404 then places a second microchip 400b face-down on substrate 406, aligns the two microchips 400 a, 400 b,and moves second microchip 400 b such that nodules 402 b are alignedwith nodules 402 a on first microchip 400 a. In an embodiment, lateralpressure is applied along the x-axis between the first and secondmicrochips 400 a, 400 b (for example, by the manipulator 404). Secondmicrochip 400 b is then held securely in place similarly to firstmicrochip 400 a. As will be apparent to one of skill in the art,multiple manipulators 404 could be used, for example, to secure orposition both microchips 400 a, 400 b simultaneously.

As both microchips are located face-down, the nodules 402 a, 402 b arelocated the same distance above the substrate 406 regardless of whetherthe two microchips 400 a, 400 b are of equal thicknesses. This allowsmicrochips manufactured from different materials (or wafers of varyingthicknesses) to be joined, so long as the microchips have complementarynodules that are manufactured contiguous to or a predetermined distancebelow the top face of the respective microchip. As described above,modules 402 a, 402 b are then joined (e.g., by using solder reflow).

Also or alternatively, substrate 406 may include a conductive segment orcontact 410 positioned in alignment with nodules 402 a, 402 b whenmicrochips 400 a, 400 b are positioned as shown in FIG. 4. In anembodiment, conductive segment or contact 410 may be connected to one ormore other electronic devices of substrate 406 or disposed on substrate406. In an embodiment, conductive segment or contact 410 may be aconductive trace or contact on substrate 406 which in an embodiment maybe a printed circuit board. Once nodules 402 a, 402 b are located inalignment with conductive segment or contact 410 as shown in FIG. 4,nodules 402 a, 402 b and conductive segment or contact 410 are joinedelectrically in any suitable and/or desirable manner (e.g., via solderreflow). An advantage of nodules 402 a, 402 b in alignment withconductive segment or contact 410 is the facilitation of the visualinspection of nodules 402 a, 402 b and conductive segment or contact 410after joining together, rework of a faulty joining together, and spacingbetween microchips 400 a, 400 b while simultaneously forming anelectrical connection between nodules 400 a, 400 b and conductivesegment or contact 410 thereby facilitating a flow of cooling fluid(air) between microchips 400 a, 400 b.

Referring to FIG. 5, a method of joining two or more microchips 500 a,500 b of different heights without using a stage or other surface isdescribed. As shown in FIG. 5, a first manipulator 504 a positions afirst microchip 500 a in space. First microchip 500 a is then secured inplace (e.g., by locking manipulator 504 a in place). A secondmanipulator 504 b positions a second microchip 500 b in space. Forexample, second manipulator 504 b will align the nodules 502 a, 502 b ofthe two microchips 500 a, 500 b along both the y- and z-axes. As will beclear to one of skill in the art, this allows for microchips ofdifferent thicknesses to be easily connected. Second manipulator 504 bis then prevented from moving in the aligned axes. Second manipulator504 b then moves the second microchip 500 b along the x-axis untilnodules 502 b on second microchip 500 b contact nodules 502 a on firstmicrochip 500 a. One or both of manipulators 504 a, 504 b then applylateral pressure between microchips 500 a, 500 b along the x-axis.Second microchip 500 b is then secured in space (e.g., by locking secondmanipulator 504 b from moving). Microchips 500 a, 500 b are then joined,for example, via solder reflow.

Referring to FIGS. 6A and 6B, a method of joining two or more microchips600 a, 600 b into three-dimensional (3D) arrangements is described. Afirst microchip 600 a is positioned on a substrate 606 using amanipulator 604 and subsequently is secured in place. The firstmicrochip 600 a is created with holes or sockets 602 a located along itstop face 608. In one embodiment, these holes are coated in solder. Asecond microchip 600 b is then positioned above first microchip 600 a bymanipulator 604. Each of the nodules 602 b along an edge 610 of secondmicrochip 600 b is aligned with respective holes or sockets 602 a onfirst microchip 600 a. As described above, merely aligning a singlenodule-hole pair may cause an inadequate or non-existent connectionbetween some nodules 602 b and holes 602 a if microchips 600 b, 600 aare misaligned or skewed, as other nodule-hole pairs may be misaligned.Accordingly, in an embodiment, two or more nodule-hole pairs located atopposite ends of second microchip 600 b are checked to ensure properalignment has been achieved.

As shown in FIG. 6B, nodules 602 b on second microchip 600 b are thenmoved into alignment and contact holes or sockets 602 a on firstmicrochip 600 a and pressure is applied between the two microchips 600a, 600 b, for example by the manipulator 604 to press nodules 602 b intoholes 602 a. The two microchips 600 a, 600 b are then joined, forexample by using solder reflow. Additional microchips can then beconnected to either the first or second microchip 600 a, 600 b insimilar fashion. In an alternative embodiment, first microchip 600 acould be held by a manipulator and positioned in space, without using astage to support it. Second microchip 600 b could then be aligned andmoved into alignment and contact with first microchip 600 a by a secondmanipulator. This process could be repeated for any number ofmicrochips, thereby creating a three-dimensional array of interconnectedmicrochips.

Referring to FIGS. 7 and 8, a method of joining an arbitrary number ofmicrochips is described. As shown in FIG. 7, four microchips 700 a, 700b, 700 c, 700 d may be joined into a 2×2 array by first creating twopairs 702 a, 702 b of connected microchips—joined together in any mannerdescribed herein. Then, the two pairs 702 a, 702 b of microchips arejoined together, in any manner described herein, to form a single arraycomposed of four interconnected microchips 700 a, 700 b, 700 c, 700 d.

As will be understood by one of skill in the art, an arbitrary number ofmicrochips could be joined together in any manner described hereintogether in any manner described herein in similar fashion. For example,a system comprised of an odd number of microchips could be formed byfirst forming and connecting pairs of microchips and then joining asingle unpaired microchip. Similarly, an arbitrary number of microchipsof different shapes or sizes could be joined into an interconnectedarray using this technique. For example, nodules may be located alongthe interior edges of all microchips in the array, forming electricaland mechanical connections between all adjacent microchips and allowingeach microchip to communicate directly with all adjacent microchips.Similarly, microchips may relay signals, so as to allow non-adjacentmicrochips in the array to communicate. Additional nodules could beformed along exterior edges, for example to allow additional microchipsor other electrical devices to be connected to the array.

FIG. 8 depicts a generalized process for creating an arbitrarily largearray of interconnected microchips. As described above, in step 800, twomicrochips are joined (creating a pair of microchips). At step 802, adetermination is made if additional microchips need to be added to thearray. If no microchips need to be added, then the process ends at step810. If more microchips need to be added, then a determination is madeat step 804 whether there are two or more microchips to add. If so, thentwo microchips are joined into a pair at step 806 and are added to thearray at step 808. The process then repeats by checking whether moremicrochips need to be added at step 802. Alternatively, if there is onlya single microchip to add at step 804, then the single microchip isadded at step 812 and the process ends at step 814.

As will be clear to one of ordinary skill in the art, the processdescribed in FIG. 8 creates an array of microchips that is twomicrochips wide and an unlimited number of microchips long.Alternatively, the process may be modified to create an array ofarbitrary size. For example, a 8×8 array of sixty-four square microchipscould be created by first creating thirty-two pairs of microchips, asdescribed above. Each pair (or 2×1 array) is then treated as a singlemicrochip, and paired again to create sixteen 2×2 arrays. The processrepeats, successively pairing microchips to create eight 4×2 arrays,four 4×4 arrays, two 8×4 arrays, and finally a single 8×8 array. Asimilar form of this process could be used to join microchips of anyshape into an array of arbitrary size.

What has been described above includes examples of aspects of theclaimed subject matter. It is, of course, not possible to describe everyconceivable combination of components or methodologies for purposes ofdescribing the claimed subject matter, but one of ordinary skill in theart may recognize that many further combinations and permutations of thedisclosed subject matter are possible. Accordingly, the disclosedsubject matter is intended to embrace all such alterations,modifications, and variations that fall within the spirit and scope ofthe appended claims. Furthermore, to the extent that the terms“includes”, “has”, “having”, or variations in form thereof are used ineither the detailed description or the claims, such terms are intendedto be inclusive in a manner similar to the term “comprising” as“comprising” is interpreted when employed as a transitional word in aclaim.

The invention claimed is:
 1. A microchip unit comprising: a firstmicrochip including holes or sockets along a top face of the firstmicrochip; and a second microchip including nodules extending from aedge of the second microchip; wherein the nodules of the secondmicrochip are received in the holes or sockets along the top face of thefirst microchip.
 2. The microchip unit of claim 1, wherein the holes orsockets along a top face of the first microchip are coated in solder. 3.The microchip unit of claim 1, wherein the first and second microchipsare joined by solder.